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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LDBK2043-W81 DATA SHEET DOC. NO : REV. DATE : : QW0905- LDBK2043-W81 A 06 -May. - 2009 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK2043-W81 Page 1/5 Package Dimensions Thermo-shrinking tube 3.0 4.0 202 1.5MAX 4.2 5.2 5.00.5 705mm 0.5 TYP 2.54TYP Red Line Black Line Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation -30X -60X 100% 75% 50% -+ 2.00.5 0X 30X 60X 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK2043-W81 Page 2/5 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol DBK Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 100 120 50 500 -20 ~ +80 -30 ~ +100 mA mA mW UNIT g A V J J Static the Use of conductive wrist band or anti-electrosatic * glove isElectricity or power surge will damageLED.LED.devices, aequipment and machinery must be properly recommended when handing these All grounded. Typical Electrical & Optical Characteristics (Ta=25 J ) PART NO MATERIAL Emitted COLOR Lens Water Clear Forward Dominant Spectral voltage wave halfwidth @ 20mA(V) length f nm f Dnm Luminous intensity @20mA(mcd) Viewing angle 2c 1/2 (deg) Typ. Max. Min. Typ. 470 30 3.5 4.0 1100 3400 30 LDBK2043-W81 InGaN/GaN Blue Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK2043-W81 Page 3/5 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage 1000 Fig.2 Relative Intensity vs. Forward Current 3.0 Forward Current(mA) 100 10 1 01 1.0 2.0 3.0 4.0 5.0 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 1 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25 J Relative Intensity@20mA Normalize @25 J 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature( J ) Ambient Temperature( J ) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 400 450 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK2043-W81 Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp( C) 260 C3sec Max 5 /sec max 120X 2 /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) 260X 25X 0X 0 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK2043-W81 Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105JO 5J 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65JO 5J 2.RH=90%~95% 3.t=240hrsO 2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 J O 5J &-40JO (10min) (10min) 2.total 10 cycles 5J The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 J O 5J 2.Dwell time= 10O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solderability Test 1.T.Sol=230 J O 5J 2.Dwell time=5 O 1sec |
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